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This paper describes recent work in the science of the separable electronic pressure contact with emphasis on chemical factors in performance. The following topics are discussed: growth and morphology of sulfide tarnish films which creep across the interface between gold plate and silver or copper alloys and degrade contact performance; the formation and structure of corrosion solids on porous gold electroplated contacts, and which originate in atmospheres polluted with sulfur dioxide or hygroscopic dusts; new developments in measuring the porosity in precious metal plates; the critical dependence of the porosity of gold plate on substrate roughness; and new concepts for developing electronic connectors with contacts made of base metals.
Parts, Materials and Packaging, IEEE Transactions on (Volume:2 , Issue: 3 )
Date of Publication: Sep 1966