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This paper contains a description of the concepts and techniques used in the electronic packaging of the Phoenix Missile Electronics Unit. The unit consists of etched circuit chassis pairs sandwiched between heat transfer panels. The sandwiches of heat transfer panels and chassis are compressed by end plates. Circuits such as logic networks, audio amplifiers and high gain DC amplifiers are packaged in unique, welded, plug-in modules; circuits such as IF amplifiers and crystal-controlled oscillators are packaged in individual welded modules contained within aluminum investment casting s. The other major features described are methods of providing thermal control and structural in- tegrity.