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Solderless Wrapped Connection

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1 Author(s)
R. Mallina ; Bell Telephone Laboratories

The solderless wrapped connection is introduced. The terms automatic factory and assembly are defined. Electronic industry growth over the last 30 years is discussed and its expansion during the next 10 years is predicted at 300 percent. The importance of modular building blocks and modular terminal spacing, in the program of standardization for automation, is emphasized. The solid-wire solderless wrapped connection is examined; hand wrapping tools, a wrapping gun and wrapping techniques are discussed. The high contact pressure principle is developed and documented by several photographs, drawings, arid curves. Data is presented concerning the relaxation of contact-tension with time and temperature. It is shown that tension reaches the 50 percent point in times varying from three hours (at 170 degrees C) to 40 years (at 57 degrees C). Reliability of the solderless wrapped connection and that of the solder connection are compared under vibration. Other advantages of the solderless wrapped connection are tabulated. Some applications to the wiring of telephone trunk circuit panels and general rack-and-panel wiring installations are given. Mr. Mallina concluded his talk by showing a motion picture of the wrapping gun in action.

Published in:

IRE Transactions on Production Techniques  (Volume:1 ,  Issue: 1 )