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This paper describes the thermal analysis of a hybrid microcircuit to be used as a signal amplifier and conditioner for an IR tracking system. The details of circuit fabrication and an analysis of the electrical and noise performance of the circuit have been presented in a previous paper . It is the purpose of this paper to describe the use of computeraided analysis to determine the thermal performance of the circuit and to present a computer-aided approach to the thermal design of hybrid microelectronic circuits. Thermal analysis and measurements are made, revealing the temperature distribution and power-dissipating capability. These results also provide design guidelines for the layout of heat-dissipating devices such as amplifier chips. Package convection and radiation as well as internal heat conduction are modeled using node point analysis. Temperature measurements provide verification of the thermal models.
Parts, Hybrids, and Packaging, IEEE Transactions on (Volume:12 , Issue: 4 )
Date of Publication: Dec 1976