Cart (Loading....) | Create Account
Close category search window

Encapsulation of Integrated Circuits Containing Beam Leaded Devices with a Silicone RTV Dispersion

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Jaffe, D. ; Bell Laboratories,Allentown,PA

This paper reviews the results of a number of investigations which have been performed to evaluate the use of an RTV silicone rubber dispersion for the encapsulation (conformal coating) of integrated circuits containing beam leaded silicon integrated circuit (SIC) devices. The dispersion consists of approximately 67-percent xylene and 33-percent solids by weight. The investigations described include: 1 ) measurement techniques for and typical values of the properties of the as-received dispersion and of the material after curing; 2) the determination of the suitability of the dispersion to be applied to integrated circuits containing SlC's by a flowcoat technique, and of its capability to completely fill under SlC's after curing; and 3) the performance of encapsulated test specimens and circuits in some initial accelerated bias-humidity and temperature cycling tests. In addition, several other factors relevant to determining the suitability of the dispersion for particular circuit applications are briefly dis- cussed.

Published in:

Parts, Hybrids, and Packaging, IEEE Transactions on  (Volume:12 ,  Issue: 3 )

Date of Publication:

Sep 1976

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.