By Topic

The Plasma Oxidation of Metals in Forming Electronic Circuit Components

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
M. Johnson ; Burroughs Corp., Paoli, PA

This study involves the fabrication of tantalum-pentoxide capacitors by other than the conventional thermal or aqueous electrolytic techniques. A new method of dielectric formation is described, and some of the results of the measurements performed on the passive devices are presented. This plasma-anodic process is then compared to the aqueous anodic processes, with the emphasis upon the compatibility of dry anodization techniques to vacuum techniques for the deposition of metallic thin films.

Published in:

IEEE Transactions on Component Parts  (Volume:11 ,  Issue: 2 )