By Topic

Interconnection of Integrated Circuit Flat Packs in Autonetics Improved Minuteman Program

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Harmon, E. ; Data Systems Division, Autonetics, Div. of North Am. Aviation, Inc.

Design studies for the Improved Minuteman computer reveal the necessity for advanced microcircuit interconnection techniques in order to capture the potential advantages of integrated circuits. The development of a unique multilayer board concept is described in terms of such factors as design procedures; masking techniques; and fabrication, test and rework methods. With reliability as the dominant factor in all trade-off studies the significance of physical and electrical parameters is discussed as well as the influence of considerations of producibility, yield, and system constraints.

Published in:

Component Parts, IEEE Transactions on  (Volume:11 ,  Issue: 2 )