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As a step toward achieving high volume, low-cost production of tantalum film circuits, a continuous tantalum sputtering chamber has been designed and tested. This device yields up to 800 high quality tantalum coated substrates per day, depending upon the film,thickness desired. Output can be increased by increasing sputtering power. The system features automatic feed of substrates into and out of the vacuum chamber without breaking the vacuum, thereby eliminating the inefficiencies of batch-type operation. Evaluation of sample substrates indicates a uniformity of sheet resistivity which is better than one percent across the surface of a given substrate. The sheet resistivity varies a maximum of ten percent between substrates.