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This paper discusses the use of liquid resin systems for potting, casting or encapsulating microelectronic devices. Subject matter includes discussions on epoxies, silicones, polyurethanes, polyesters and thermosetting hydrocarbons and their modifications. Discussed in detail are the large number of modifications possible in epoxies using a variety of curing agents, flexibilizers and diluents. The important properties of the subject materials are discussed in regard to their utilization in microelectronic devices.