By Topic

Electrical Characteristics of Copper/Polyimide Thin-Film Multilayer Interconnects

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Lane, T. ; Honeywell Physical Sciences Center,Bloomington ; Belcourt, F. ; Jensen, R.

A multilayer substrate Containing two-chip emitter-coupled logic (ECL) ring oscillator circuits was fabricated and tested to determine the static and dynamic electrical characteristics of the copper/polyimide thin-film multilayer (TFML) interconnections between chips. The circuit oscillated at 122 MHz without delay lines; delay lines in the circuit enabled measurement of 88 ps/cm propagation delay and -28 dB crosstalk between adjacent parallel lines. The measured electrical characteristics agreed with predictions obtained from static electrical models and SPICE simulations of the interconnections. The ring oscillator circuit has general applications for determining dynamic electrical characteristics of a variety of packaging structures, such as co-fired ceramic single-chip packages and tape-automated-bonding (TAB) leadframes.

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:10 ,  Issue: 4 )