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Browse Journals & Magazines > Components, Hybrids, and Manu ...> Volume:10 Issue:4 Help

Life Estimation For IC Plastic Packages Under Temperature Cycling Based on Fracture Mechanics

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4 Author(s)
Nishimura, A. ; Hitachi Ltd,Japan ; Tatemichi, A. ; Miura, H. ; Sakamoto, T.

The strength of plastic encapsulants is analyzed from the viewpoint of crack propagation. With a preexisting crack length a and a specific number of applied load cycles N, fatigue crack propagation rates da/dN of the encapsulants were measured with laboratory test specimens. It was found that the da/dN of encapsulants can be expressed as functions of the stress intensity factor rangeDeltaK. The crack propagation behavior in the package was estimated from the data of da/dN andDeltaK at the lowest temperature of the test cycles. Reasonable correlation is found between the estimated crack propagation behavior and the observed one. The applicability of fracture mechanics to the package Cracking problem is demonstrated.

Published in:
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:10 ,  Issue: 4 )

Date of Publication: Dec 1987

Page(s):
637 - 642
ISSN :
0148-6411
Digital Object Identifier :
10.1109/TCHMT.1987.1134777
Product Type:
Journals & Magazines
Date of Current Version :
06 January 2003
Issue Date :
Dec 1987
Sponsored by :
IEEE Components, Packaging, and Manufacturing Technology Society

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