Skip to Main Content
Photosensitive polyimides have been investigated as substitutes for a standard aqueous base-etchable polyimide. The application uses a ceramic base module on which two layers of metal circuits are separated by a polyimide dielectric. Using a photosensitive polyimide reduces the number of steps and shortens the process time required to form the via interconnections. Processing properties and material properties were studied to select a material which would give optimum throughput. The photosensitive polyimides investigated were primarily developed for IC processing; adaption to packaging applications requires adjustment of processes. Polyimide application, drying, baking, exposure, developing, and final cure must be optimized to use these materials successfully.
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on (Volume:10 , Issue: 4 )
Date of Publication: Dec 1987