By Topic

Pb-Sn Alloy Microstructure: Potential Reliability Indicator for Interconnects

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
G. O'Clock ; Mankato State University,MN ; M. Peters ; J. Pater ; G. Kleese
more authors

Investigation of the microstructure and chemistry of Pb-Sn alloy interconnects by scanning electron microscopy (SEM) and X-ray microanalysis shows that certain physical and chemical characteristics of the Pb-rich and Sn-rich phases are indicative of crack formation during temperature cycling. Those solder alloy interconnects that crack when temperature cycled exhibit significantly different microstructure patterns compared with solder interconnects that do not crack. Energy dispersive X-ray (EDX) data indicate that cracking is more pronounced when impurities such as Al, Au, or W are inadvertently introduced into the alloy material.

Published in:

IEEE Transactions on Components, Hybrids, and Manufacturing Technology  (Volume:10 ,  Issue: 1 )