Referenced Items are not available for this document.
The effect of pull temperature on oxide charge and interface trap density is explored using surface charge analysis (SCA). With this technique, lower pull temperatures were found to result in lower oxide charge and interface trap density levels. The impact of pull temperature on these parameters was found to exist even after a number of additional processing steps. SCA was used to evaluate the individual charge contribution of each step within a process sequence
Published in:
Advanced Semiconductor Manufacturing Conference and Workshop, 1990. ASMC 90 Proceedings. IEEE/SEMI 1990
Date of Conference: 11-12 Sep 1990
- Page(s):
- 117 - 120
- Meeting Date :
- 11 Sep 1990-12 Sep 1990
- INSPEC Accession Number:
- 3966502
- Conference Location :
- Danvers, MA
- Digital Object Identifier :
- 10.1109/ASMC.1990.111234
- Product Type:
- Conference Publications
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