Cart (Loading....) | Create Account
Close category search window

The use of via holes for controlling the crosstalk of nonparallel microstrip lines on PCBs

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Fengchao Xiao ; Dept. of Inf. & Commun. Eng., Univ. of Electro-Commun., Tokyo, Japan ; Murano, K. ; Kami, Y.

In this work, the metal filled via holes are constructed into fences between the nonparallel microstrip lines to control the crosstalk. In practice, coupling between nonparallel traces is common. On the other hand, via holes are easy and inexpensive to build using the current fabrication process for the commonly used PCBs. The effects of the via holes for alleviating the coupling are investigated experimentally and numerically. The crosstalk is controlled by adjusting the position of the via holes, the structure of via fence, and the length of the via fence. Some design guidelines for the proper placement of the via holes are concluded. Experiments are conducted and the calculated results are compared with the measured data.

Published in:

Electromagnetic Compatibility, 2002. EMC 2002. IEEE International Symposium on  (Volume:2 )

Date of Conference:

19-23 Aug. 2002

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.