By Topic

Three-dimensional x-ray laminography as a tool for detection and characterization of BGA package defects

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
T. D. Moore ; Analog Devices BV, Limerick, Ireland ; D. Vanderstraeten ; P. M. Forssell

Non-destructive examination of the layers of a built-up substrate was achieved using three-dimensional (3-D) x-ray microlaminography, with successful separation of layers as thin as 8 μm. The same technology was used to create reconstructed images of both surface and internal details of inner solder balls in a ball grid array package soldered to a printed circuit board. Microlaminography was also used to identify bond-wire shorts in the plane of the solder resist of a ball grid array assembly, and these were subsequently verified by destructive physical analysis. This plane is 20 μm thick and immediately adjoining a plane of copper traces; the success demonstrates the capability of microlaminography to resolve and separate very fine detail internally within IC structures. The limits of capability of this machine were also determined; it was found that a crack of approximately 5 μm wide in a copper trace of a BGA was not detected by the machine. As an introduction, the technology and methodology of 3-D x-ray microlaminography are explained. The results from a microlaminography system adapted for failure analysis in integrated circuit packaging are presented. It is shown that such results could not be extracted by two-dimensional (2-D) x-ray or other nondestructive methods

Published in:

IEEE Transactions on Components and Packaging Technologies  (Volume:25 ,  Issue: 2 )