By Topic

Equipment productivity improvement via inline qualification implementation

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
N. Lafferty ; Rochester Inst. of Technol., NY, USA ; B. Fiol ; P. Jowett ; Y. Karzhavin
more authors

This paper discusses inline etch equipment qualification implementation at the 200 mm Infineon Technologies Richmond fab. Traditional etch equipment qualification requires offline etching of test blanket (or pattern) wafers of known thickness during a defined period. The process etch rate can be calculated using known film thickness and etch time. Data is obtained using an SPC system, which is then used to qualify the tool set. As a part of process control and data acquisition, time of etch is currently being monitored for automatic endpoint steps. The etch time is collected by an equipment integration software package, which communicates directly with the tool and records readings from sensors, step times, and other process conditions. The etch time is then combined with SPC gathered pre etch film thickness to determine an inline, on product, process etch rate. This gives the ability to monitor a chamber's performance without a costly break in the production for purposes of running a test wafer. This also allows instant detection of an out of control (OOC) process and prevents a significant scrap event.

Published in:

Advanced Semiconductor Manufacturing 2002 IEEE/SEMI Conference and Workshop

Date of Conference: