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Electromagnetic interconnects and passives modeling: software implementation issues

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2 Author(s)
Schoenmaker, W. ; IMEC, Heverlee, Belgium ; Meuris, P.

This is the second paper in a series on the simulation of on-chip high-frequency effects. A computer-aided approach in three dimensions is advocated, describing high-frequency effects such as current redistribution due to the skin-effect or eddy currents and the occurrence of slow-wave modes. The electromagnetic environment is described by an electric scalar potential and a magnetic vector potential as well as a ghost field. The latter one guarantees a stable numerical implementation. This paper deals with the software implementation, the treatment of interfaces and domain boundaries, scaling considerations, numbering schemes, and solver requirements. Some illustrative examples are shown

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Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on  (Volume:21 ,  Issue: 5 )