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Electromagnetic interconnects and passives modeling: software implementation issues

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2 Author(s)
Schoenmaker, W. ; IMEC, Heverlee, Belgium ; Meuris, P.

This is the second paper in a series on the simulation of on-chip high-frequency effects. A computer-aided approach in three dimensions is advocated, describing high-frequency effects such as current redistribution due to the skin-effect or eddy currents and the occurrence of slow-wave modes. The electromagnetic environment is described by an electric scalar potential and a magnetic vector potential as well as a ghost field. The latter one guarantees a stable numerical implementation. This paper deals with the software implementation, the treatment of interfaces and domain boundaries, scaling considerations, numbering schemes, and solver requirements. Some illustrative examples are shown

Published in:

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on  (Volume:21 ,  Issue: 5 )

Date of Publication:

May 2002

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