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An integrated approach to power electronics systems

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4 Author(s)
F. C. Lee ; Bradley Dept. of Electr. & Comput. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA ; J. Daan Van Wyk ; D. Boroyevich ; P. Barbosa

Power electronics systems are typically designed and manufactured using nonstandard parts, which results in labor-intensive manufacturing processes and increased cost. As a possible way to overcome these problems, this paper provides an overview of an integrated approach to design and realize power electronics systems, aiming at improved performance, reliability, manufacturability and cost effectiveness. A brief discussion is presented on the technology barriers that limit the rapid growth of power electronics, such as passive components and packaging techniques. It is also discussed the technology advancements needed to improve the characteristics of power electronics systems, such as increased levels of integration, standardization of parts and improved packaging techniques for enhanced thermal management and electrical performance. The technologies being developed for the realization of integrated systems include planar metalization to allow three-dimensional structural integration of power devices and control functions, integration of power passives, and integration of electrical/thermal design tools

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Power Conversion Conference, 2002. PCC-Osaka 2002. Proceedings of the  (Volume:1 )

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