Skip to Main Content
CMP aims at providing universities, research laboratories and industries with the possibility of having their integrated circuit projects fabricated for prototyping and low volume production. Presently, users are serviced for CMOS double layer poly/double layer metal (DLP/DLM) 0.8 μm, DLM/TLM 0.6 μm, DLP/4LM 0.35 μm, SLP/6LM 0.25 μm, SLP/6LM 0.18 μm, BiCMOS DLP/DLM 0.8 μm, SiGe HBT 0.8 μm DLP/DLM, SiGe HBT 0.35 μm SLP/5LM and GaAs HEMT 0.2 μm. About 40 multi-project runs are offered per year. Micro Electro Mechanical Systems (MEMS) are also provided in standard CMP runs in CMOS DLP/DLM 0.8 μm and 0.6 μm, BiCMOS DLP/DLM 0.8 μm and HEMT GaAs 0.2 μm, using compatible front-side bulk micro-machining. MUMPS is offered as a surface micro-machining process, allowing one to integrate MEMS only microstructures. Finally, the main processes for Multi-Chip Modules (MCMs) are also available through CMP.