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Low-cost package technology for advanced MMIC applications

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11 Author(s)
S. Chai ; Teledyne Monolithic Microwave, Mountain View, CA, USA ; R. Kirschman ; S. Ludvik ; J. Bedinger
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The availability of MMICs (monolithic microwave integrated circuits) along with expanded applications for microwave components places increasing demands on performance and cost of package technology. A report is presented on the progress in meeting these demands with metal-injection molding (MIM) of metal-matrix composites for advanced microwave packaging technology. Experiences in developing this technology, including dimensional control, plating, hermeticity, and cost, are given. The electrical performance of packaged multichip amplifiers operating at 2-20 GHz is also described.<>

Published in:

Microwave Symposium Digest, 1990., IEEE MTT-S International

Date of Conference:

8-10 May 1990