Low-cost package technology for advanced MMIC applications

The availability of MMICs (monolithic microwave integrated circuits) along with expanded applications for microwave components places increasing demands on performance and cost of package technology. A report is presented on the progress in meeting these demands with metal-injection molding (MIM) of metal-matrix composites for advanced microwave packaging technology. Experiences in developing this technology, including dimensional control, plating, hermeticity, and cost, are given. The electrical performance of packaged multichip amplifiers operating at 2-20 GHz is also described.<
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