By Topic

Analysis of stratified testing for multichip module systems

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Nohpill Park ; Dept. of Comput. Sci., Oklahoma State Univ., Stillwater, OK, USA ; Lombardi, Fabrizio

A stratified technique is proposed for testing multichip module systems. Stratification in multichip modules due to the different nature and procurement of these chips is exploited for achieving a high quality-level at a saving of a significant number of tests during assembly. Unlike conventional random testing, the proposed approach (referred to as the lowest yield-stratum first-testing), takes into account the uneven known-good-yield. In the lowest yield-stratum first-testing approach, the effect of the uneven known-good-yield between strata is analyzed with respect to the variance of known-good-yield and the sample size. The lowest yield-stratum first-testing approach significantly outperforms conventional random testing and random stratified testing. This method is competitive even compared to a conventional exhaustive testing at a very small loss in quality-level by greedy (first) testing the chips in the stratum with lower known-good-yield. A Markov-chain model is developed to analyze these testing approaches under the assumption of physically independent failure of chips in multichip module systems

Published in:

Reliability, IEEE Transactions on  (Volume:51 ,  Issue: 1 )