We are currently experiencing intermittent issues impacting performance. We apologize for the inconvenience.
By Topic

Random pattern testability of the open defect detection method using application of time-variable electric field

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Yotsuyanagi, H. ; Dept. of Electr. & Electron. Eng., Tokushima Univ., Japan ; Hashizume, M. ; Iwakiri, T. ; Ichimiya, M.
more authors

In this paper, random pattern testability of the open defect defection method is discussed. In the test method, time-variable electric field is applied from the outside of ICs so as to vary the voltage at floating nodes caused by a defect. To detect opens the excessive supply current caused by the applied electric field is measured. The test pattern requirements for detecting opens are shown. The fault coverage for open defects is calculated for benchmark circuits. The experimental results shows random pattern can be effectively utilized for the test method even if it cannot attain high fault coverage for stuck-at-faults

Published in:

Electronic Design, Test and Applications, 2002. Proceedings. The First IEEE International Workshop on

Date of Conference: