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Cost-effective and manufacturable route to the fabrication of high-density 2D micromachined ultrasonic transducer arrays and (CMOS) signal conditioning electronics on the same silicon substrate

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11 Author(s)
R. A. Noble ; Malvern Technol. Centre, QinetiQ Ltd, Great Malvern, UK ; R. R. Davies ; M. M. Day ; L. Koker
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The ability to fabricate Capacitive Micromachined Ultrasonic Transducers (cMUTs) and signal conditioning electronics together on the same silicon substrate offers significant benefits to overall transducer performance, and simplifies connectivity within a dense 2D transducer array. This integration of cMUTs and electronics has been demonstrated utilising a low-temperature silicon nitride membrane technology, post-processed onto CMOS-ASIC substrates. Successful results from fabricated arrays of cMUTs and front-end analogue amplifiers confirm the integration to be relatively simple and highly manufacturable

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Ultrasonics Symposium, 2001 IEEE  (Volume:2 )

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