Cart (Loading....) | Create Account
Close category search window
 

Optomechanical model of surface micromachined tunable optoelectronic devices

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Lin, Chien-chung ; Solid State & Photonics Lab., Stanford Univ., CA, USA ; Martin, W.A. ; Harris, James S.

Linewidth is a critical performance parameter for many optoelectronic devices. We have developed a combined optical and mechanical simulation tool and demonstrate its application to micromachined vertical-cavity tunable optoelectronic devices. The deformation of the mirror surface is calculated from the area moment method. The optical field distribution is calculated by the Fox-Li method, and the diffraction losses are estimated from second-order perturbation theory. By comparison to experimental results, we find that the deformation of the central plate is well predicted by our theory. While deformation can be a major source of linewidth broadening in MEMS tunable optoelectronic devices, it is not the primary source in our devices

Published in:

Selected Topics in Quantum Electronics, IEEE Journal of  (Volume:8 ,  Issue: 1 )

Date of Publication:

Jan/Feb 2002

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.