Cart (Loading....) | Create Account
Close category search window

Spray/jet cooling for heat flux high to 1kW/cm/sup 2/

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Chunlin Xia ; Coherent Inc., Santa Clara, CA, USA

High heat fluxes from relatively small surfaces as high as to 1kW/cm/sup 2/ are needed to be removed in the cooling of microelectronic chips. Spray cooling and jet cooling with high CHF and small wall temperature rise are attractive for use. To combine the advantages of spray and jet cooling together to reach the maximum cooling capacity, the present work designed new spray head including micro nozzle array and piezoelectric plate's vibration. The experimental results point out that this is a promising method using micro nozzle array and piezoelectric plate to break bulk liquid or streams into micro droplets. In this way the diameter of liquid droplets, velocity, and their locations can easily be controlled. Spray head A has a higher heat transfer coefficient with low wall superheat by forming a stable thin liquid film on the heated surface.

Published in:

Semiconductor Thermal Measurement and Management, 2002. Eighteenth Annual IEEE Symposium

Date of Conference:

12-14 March 2002

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.