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Determining partial thermal resistances with transient measurements, and using the method to detect die attach discontinuities

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4 Author(s)
Rencz, M. ; MicReD Ltd., Budapest, Hungary ; Szekely, V. ; Morelli, A. ; Villa, C.

The evaluation of the thermal transient measurements may result in the time constant density function and the structure function of the measured structure. In this paper we show how these results can be used to detect die attach or soldering problems of packages. Another application of the method in detecting partial thermal resistances in the heat flow path is also presented and evaluated.

Published in:

Semiconductor Thermal Measurement and Management, 2002. Eighteenth Annual IEEE Symposium

Date of Conference:

12-14 March 2002