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Single chamber compact two-phase heat spreaders with microfabricated boiling enhancement structures

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3 Author(s)
Murthy, S.S. ; George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; Joshi, Y.K. ; Nakayama, W.

Presents the thermal performance evaluation of a compact single-chamber two-phase heat spreader. The heat spreader setup has a central evaporator section with integrated fins for cooling along the edges. The evaporator employs a micro-fabricated three-dimensional (3-D) copper structure for enhancing boiling heat transfer. The thermal performance of the system was characterized at various power levels and condenser cooling conditions. The size of the boiling enhancement structure and effects of liquid fill volumes on performance were also investigated. Incorporation of the enhancement structure resulted in an improvement in the spreader thermal performance by decreasing the wall temperature at the evaporator by 8°C, for a power dissipation of 36 W/cm2 at an air speed of 1 m/s. The maximum heat flux obtained based on a maximum evaporator temperature of 75°C for an air speed of 1 m/s was 42.5 W/cm2. Variation in the liquid fill volume showed negligible effect on the maximum temperature at the evaporator, as long as the enhanced structure was fully flooded

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Components and Packaging Technologies, IEEE Transactions on  (Volume:25 ,  Issue: 1 )