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Effective elastic modulus of underfill material for flip-chip applications

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2 Author(s)
Qu, J. ; George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; Wong, C.P.

In this paper, a micromechanics model based on the Mori-Tanaka method was developed to estimate the elastic modulus of underfill materials. An explicit expression of the underfill modulus was derived as a function of filler content and the properties of the matrix and the fillers. Predictions of the modulus from this theory were compared with experimentally measured values. Excellent agreement was observed

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Components and Packaging Technologies, IEEE Transactions on  (Volume:25 ,  Issue: 1 )