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Effective elastic modulus of underfill material for flip-chip applications

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2 Author(s)
Jianmin Qu ; George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; C. P. Wong

In this paper, a micromechanics model based on the Mori-Tanaka method was developed to estimate the elastic modulus of underfill materials. An explicit expression of the underfill modulus was derived as a function of filler content and the properties of the matrix and the fillers. Predictions of the modulus from this theory were compared with experimentally measured values. Excellent agreement was observed

Published in:

IEEE Transactions on Components and Packaging Technologies  (Volume:25 ,  Issue: 1 )