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Aspocomp has been manufacturing HDI PWBs at Salo for more than five years. The chief focus has been on increasing packaging density and on accommodating the needs of future chip scale packages. In volume production, cost and performance have to be balanced. As a result, manufacturing and material yields, process automation, the cost of materials and added value technologies like embedded passives are key considerations in meeting the high volume requirements of the marketplace. This paper will describe how these parameters have evolved over time and how it has been possible to achieve the stringent tolerances required in both the manufacturing and assembly processes.
Date of Conference: 3-6 March 2002