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Effects of process parameters on the mold adhesion force in IC encapsulation process

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4 Author(s)
Hwang Shen-Jye ; Dept. of Mech. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan ; Lee Huei-Huang ; Chuang Chun-Hua ; Huang Duan Yuan

In IC packaging, when epoxy molding compound (EMC) is filling the mold cavity and cured in the mold, adhesion occurs in the interface between EMC and mold surface. Too large an adhesion force can damage an IC and lower the yield rate. However, there was no report showing how to measure the mold adhesion force. This paper described the design and fabrication of an automatic EMC adhesion force test instrument that will measure adhesion force between mold surface and EMC. By measuring the adhesion force, one can judge how much does a specific type of surface treatment help in reducing the amount of mold adhesion force. This paper also described the study of the IC encapsulation mold adhesion force using Taguchi's parameter design method. By using Taguchi's method, one can determine what parameters are important for reducing the magnitude of adhesion force between EMC and mold surface

Published in:

Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on

Date of Conference:

2002