By Topic

Reliability of electrically conductive adhesives

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Kudtarkar, S.A. ; Dept. of Mech. Eng., State Univ. of New York, Binghamton, NY, USA ; Morris, J.E.

This paper presents data on various ICA reliability tests on electro migration, galvanic corrosion and impact resistance. Ag-loaded ICA samples are prepared with both Ag and Cu metallization pads. Some of these samples are then cured with and with out pre heating. These samples are then successively dropped from heights between one and six feet. Drop test performance is affected by the curing profile detail. Some samples are also subjected to 85/85 humidity tests to study electromigration and galvanic corrosion. Copper and silver boards are used for this and their results are then compared

Published in:

Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on

Date of Conference: