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Integration of microstrip patch antenna on ceramic ball grid array package

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1 Author(s)
Zhang, Y.P. ; Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore

A novel concept of integration of an antenna on an integrated circuit package is proposed for the single-chip solutions of wireless transceivers. A prototype antenna integrated on a thin ceramic ball grid array package is reported. Results show that the antenna achieved impedance bandwidth of 4.65% and radiation efficiency of 65% at 5.52 GHz

Published in:

Electronics Letters  (Volume:38 ,  Issue: 5 )