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Novel power MOSFET packaging technology doubles power density in synchronous buck converters for next generation microprocessors

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3 Author(s)
Sawle, A. ; Int. Rectifier Corp., El Segundo, CA, USA ; Blake, C. ; Maric, D.

This paper introduces a novel power packaging technology developed by International Rectifier. This new packaging technology breaks ground in reducing package related losses and thus allowing designers to develop power supplies capable of meeting the demands of latest generation processors

Published in:

Applied Power Electronics Conference and Exposition, 2002. APEC 2002. Seventeenth Annual IEEE  (Volume:1 )

Date of Conference:

2002