By Topic

Novel power MOSFET packaging technology doubles power density in synchronous buck converters for next generation microprocessors

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Sawle, A. ; Int. Rectifier Corp., El Segundo, CA, USA ; Blake, C. ; Maric, D.

This paper introduces a novel power packaging technology developed by International Rectifier. This new packaging technology breaks ground in reducing package related losses and thus allowing designers to develop power supplies capable of meeting the demands of latest generation processors

Published in:

Applied Power Electronics Conference and Exposition, 2002. APEC 2002. Seventeenth Annual IEEE  (Volume:1 )

Date of Conference: