Cart (Loading....) | Create Account
Close category search window
 

Flip-chip flex-circuit packaging for 42 V/16 A integrated power electronics module applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Xiao, Y. ; Center for Power Electron. Syst., Rensselaer Polytech. Inst., Troy, NY, USA ; Natarajan, R. ; Chow, T.P. ; Rymaszewski, E.J.
more authors

This paper presents a novel flex-circuit power packaging platform that enables integration of power dies and control components with an advantageous form factor. The flex-circuit offers the benefits of planar interconnection and multilayer layout design flexibility with reduced parasitic inductance compared to conventional wire bonds. A half-bridge test vehicle that implements the flex-circuit packaging platform has been designed and fabricated for automotive applications (42 V, 16 A). The power flex module presents a compact configuration with electrical results indicating improved package parasitics

Published in:

Applied Power Electronics Conference and Exposition, 2002. APEC 2002. Seventeenth Annual IEEE  (Volume:1 )

Date of Conference:

2002

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.