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Flip-chip flex-circuit packaging for 42 V/16 A integrated power electronics module applications

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5 Author(s)
Xiao, Y. ; Center for Power Electron. Syst., Rensselaer Polytech. Inst., Troy, NY, USA ; Natarajan, R. ; Chow, T.P. ; Rymaszewski, E.J.
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This paper presents a novel flex-circuit power packaging platform that enables integration of power dies and control components with an advantageous form factor. The flex-circuit offers the benefits of planar interconnection and multilayer layout design flexibility with reduced parasitic inductance compared to conventional wire bonds. A half-bridge test vehicle that implements the flex-circuit packaging platform has been designed and fabricated for automotive applications (42 V, 16 A). The power flex module presents a compact configuration with electrical results indicating improved package parasitics

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Applied Power Electronics Conference and Exposition, 2002. APEC 2002. Seventeenth Annual IEEE  (Volume:1 )

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