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Hybrid integration techniques (HITs) of planar and non-planar structures are discussed for low-cost and high-performance millimeter-wave integrated circuits (ICs) and systems. Current status of this research topic is reviewed with emphasis on various integration/interconnect schemes of planar circuits and non-radiative dielectric (NRD) guides. Co-layered and aperture-coupling arrangements of planar circuits and NRD-guide are presented. Future trend is forecasted with emphasis on single substrate integration of planar and non-planar geometries. Substrate integrated circuits (SICs) are highlighted that can render the non-planar structures in planar form.
Microwave Conference, 2001. APMC 2001. 2001 Asia-Pacific (Volume:2 )
Date of Conference: 3-6 Dec. 2001