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Electrical characterization of quad flat non-lead package for RFIC applications

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5 Author(s)
Nansen Chen ; R&D Div., Siliconware Precision Ind. Co. Ltd, Taichung, Taiwan ; K. Chiang ; T. D. Her ; Yeong-Lin Lai
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The QFN package is a near chip scale package plastic encapsulated package with a coppery leadframe substrate. The purpose of this paper was to establish the wideband equivalent circuit model of QFN packages for RF applications. Only short-path configuration was required for S-parameter measurement to achieve this purpose. The comparison of S11 and S21 between S-parameter measurement and optimized equivalent circuit model verified that those results were well matched and optimized. The parasitic parameters of equivalent circuit were reliable up to 6 GHz. The methods proposed in this paper may reduce the cost for samples preparation and chip simulation run time

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Semiconductor Device Research Symposium, 2001 International

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