Referenced Items are not available for this document.
A novel single-chip condenser miniature microphone with a circular corrugated diaphragm for residual stress releasing has been proposed, fabricated and tested. The condenser microphone consists of a rigid single-crystal backplate and a flexible circular corrugated diaphragm using induced couple plasma (ICP) etching. An electrostatic-structural coupling finite element analysis (FEA) was performed for design optimization. A sensitivity of 40 mv/Pa up to 15 KHz has been achieved under a low bias voltage of 14 V, which is among the best in the presented reports
Published in:
Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference on
Date of Conference: 2002
- Page(s):
- 284 - 287
- Meeting Date :
- 20 Jan 2002-24 Jan 2002
- ISSN :
- 1084-6999
- Print ISBN:
- 0-7803-7185-2
- INSPEC Accession Number:
- 7327932
- Conference Location :
- Las Vegas, NV
- Digital Object Identifier :
- 10.1109/MEMSYS.2002.984258
- Product Type:
- Conference Publications
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