Cart (Loading....) | Create Account
Close category search window
 

Development of 3-D focused-ion-beam (FIB) etching methods for nano- and micro-technology application

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Kim, S.-J. ; NICHE, Tohoku Univ., Sendai, Japan ; Yamashita, T. ; Lee, K.-Y. ; Nagao, M.
more authors

We have developed a 3-D FIB etching method for making 3-D micro-devices and sensors based on nano- and micro-technology. We fabricated single electron tunneling (SET) devices on a Bi-2201 single crystal whisker. We also describe 3-D FIB etching methods using layered single crystal whiskers as examples. These methods offer simple in situ etching and evaporation processes in FIB systems for making a micro area of stacks.

Published in:

Microprocesses and Nanotechnology Conference, 2001 International

Date of Conference:

Oct. 31 2001-Nov. 2 2001

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.