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Study on residual stress in viscoelastic thin film using curvature measurement method

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3 Author(s)
Im, Y.T. ; Dept. of Mech. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea ; Kim, J.-H. ; Choi, S.T.

Using LSM (laser scanning method), the radius of curvature due to thermal deformation in polyimide film coated on Si substrate is measured. Since the polyimide film shows viscoelastic behavior, i.e., the modulus and deformation of the film vary with time and temperature, we estimate the relaxation modulus and the residual stresses of the polyimide film by measuring the radius of curvature and subsequently by performing viscoelastic analysis. The residual stresses relax by an amount of 10% at 100°C and 20% at 150°C for two hours

Published in:

Electronic Materials and Packaging, 2001. EMAP 2001. Advances in

Date of Conference:

2001

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