By Topic

A study of microwave curing process for underfill used in flip chip packaging. Part 2: 3D FEM simulation of microwave power distribution inside variable frequency microwave oven

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

The purchase and pricing options are temporarily unavailable. Please try again later.
5 Author(s)
Yi, Sung ; Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore, Singapore ; Lie Liu ; Chian Kerm Sin ; Fei Su
more authors

A three dimensional finite element method was used to simulate the microwave field distribution inside a variable frequency microwave (VFM) oven containing a microwave reflective substrate board. The method was verified first by analyzing two simple cases which have analytical solutions. It was found that the positions of the substrate of flip chip can affect the harmonic frequencies. The power density can be very different at various natural frequencies. It was also found that VFM oven achieve better power distribution. This may be the first instance to simulate the microwave power distribution for VFM oven

Published in:

Electronic Materials and Packaging, 2001. EMAP 2001. Advances in

Date of Conference:

2001