Scheduled System Maintenance on May 29th, 2015:
IEEE Xplore will be upgraded between 11:00 AM and 10:00 PM EDT. During this time there may be intermittent impact on performance. We apologize for any inconvenience.
By Topic

Power requirements from instrumentation for ultrasound interstitial heating at variable heat sinks location

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Jarosz, B.J. ; Inst. for Phys., Carleton Univ., Ottawa, Ont., Canada

We discuss the role of discrete heat sinks in ultrasound interstitial heating. We consider an array of four applicators used for the heating. Each of the applicators is surrounded by three microscopic heat sinks. Their distance from the applicators varies from 1.60 to 8.14 mm. We found that the heat sinks that are very close to the applicators modify temperatures very substantially. While the required power needs to be increased by about 20% with the heat sinks at 1.60 mm from the applicator, the increase of about 10 % is needed for heat sinks at 8.14 mm. The latter, however, have more dramatic effects and lead to cold regions if they are located at the periphery of ultrasound penetration

Published in:

Instrumentation and Measurement, IEEE Transactions on  (Volume:50 ,  Issue: 6 )