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Complete methodology for electrical modeling of RFIC packages

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3 Author(s)
Tzyy-Sheng Horng ; Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan ; Sung-Mao Wu ; C. Shih

A complete methodology based on broadband S-parameter measurement is proposed to establish the electrical models for radio-frequency integrated circuit (RFIC) packages. The research is focused on calibration of the test-fixture parasitics to obtain the intrinsic S-parameters from which an equivalent coupled lumped model can be extracted for any pair of package leads under test. Then a step-by-step optimization scheme is employed to construct an equivalent circuit for the whole package. A real example on modeling a 16-lead Thin Shrink Small Outline Package (TSSOP) has been demonstrated. The established model can account for various package effects at radio frequencies

Published in:

IEEE Transactions on Advanced Packaging  (Volume:24 ,  Issue: 4 )