Referenced Items are not available for this document.
This paper provides a comprehensive reliability and thermal analysis of a typical multi-layer printed wire board (PWB) wirability design. Based on some typical values of modern PWB designs, numerical solutions are provided for the junction temperature, failure rate, reliability, electrical delay and cost of typical PWBs. Then, an optimization wirability design procedure is provided by using a weighting method. The major design variable is the number of signal layers in PWB and criteria being considered are the cost, reliability and electrical performance. Monographs are provided for different design parameters
Published in:
Reliability and Maintainability Symposium, 2002. Proceedings. Annual
Date of Conference: 2002
- Page(s):
- 392 - 398
- Meeting Date :
- 28 Jan 2002-31 Jan 2002
- ISSN :
- 0149-144X
- Print ISBN:
- 0-7803-7348-0
- INSPEC Accession Number:
- 7225529
- Conference Location :
- Seattle, WA
- Digital Object Identifier :
- 10.1109/RAMS.2002.981673
- Product Type:
- Conference Publications
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