By Topic

Implementation of response surface methodology using variance reduction techniques in semiconductor manufacturing

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
McAllister, C.D. ; Marcus Dept. of Ind. & Manuf. Eng., Pennsylvania State Univ., University Park, PA, USA ; Altuntas, B. ; Frank, M. ; Potoradi, J.

Semiconductor manufacturing is generally considered a cyclic industry. As such, individual producers able to react quickly and appropriately to market conditions will have a competitive advantage. Manufacturers who maintain low work in process inventory, ensure that specialized equipment is in good repair, and produce quality products at least possible cost will have the best opportunities to effectively compete and excel in these challenging venues. To support this nimble business model, our current efforts are directed toward creating efficient, accurate metamodels of the impact of maintenance policies on production efficiency. These validated polynomial approximations facilitate rapid exploration of the design region, compared with the original simulation models. The experiment design used for metamodel construction employed variance reduction techniques. When compared to a similar experiment design using independent streams, the variance reduction approach provided a decrease in standard error of the regression coefficients and smaller average error when validated against the simulation response

Published in:

Simulation Conference, 2001. Proceedings of the Winter  (Volume:2 )

Date of Conference: