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Thermal cycling analysis of flip-chip solder joint reliability

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3 Author(s)
Pang, J.H.L. ; Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore ; Chong, D.Y.R. ; Low, T.H.

The reliability concern in flip-chip-on-board (FCOB) technology is the high thermal mismatch deformation between the silicon die and the printed circuit board that results in large solder joint stresses and strains causing fatigue failure. Accelerated thermal cycling (ATC) test is one of the reliability tests performed to evaluate the fatigue strength of the solder interconnects. Finite element analysis (FEA) was employed to simulate thermal cycling loading for solder joint reliability in electronic assemblies. This study investigates different methods of implementing thermal cycling analysis, namely using the "dwell creep" and "full creep" methods based on a phenomenological approach to modeling time independent plastic and time dependent creep deformations. There are significant differences between the "dwell creep" and "full creep" analysis results for the flip chip solder joint strain responses and the predicted fatigue life. Comparison was made with a rate dependent viscoplastic analysis approach. Investigations on thermal cycling analysis of the temperature range, (ΔT) effects on the predicted fatigue lives of solder joints are reported

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Components and Packaging Technologies, IEEE Transactions on  (Volume:24 ,  Issue: 4 )