By Topic

Transient thermal analysis of an ACF package assembly process

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
V. A. Chiriac ; Interconnect Syst. Lab., Motorola Inc., Tempe, AZ, USA ; T. Y. T. Lee

Transient thermal simulation was performed to analyze thermal response of the assembly process for a package using anisotropic conductive film (ACF). The main purpose of the study is to simulate the actual assembly and manufacturing process, in order to provide a first-hand approximation and insight of the thermal behavior of the package and ACF film during the process. Two assembly processes were modeled: a simplified process where the package was fixed at two different temperatures during assembly, and a detailed process where the package experienced a ramping heating process, followed by a constant temperature curing process. A full convection-conduction case was conducted first. The results indicate a weak hydrodynamic field and radiation effects, hence for computational purposes (reduced CPU time), it was decided to model the process using a conduction-only investigation. Results from the detailed process modeling indicated that during the initial ramping, within 0.02 s, the die and nozzle head experienced a small temperature drop due to the cooling effect of the ACF material and substrate. The ACF material also displayed a steep increase in temperature after contacting the die, followed by a short decay, then ramped up again. At the end of the 10-s ramping process, the ACF reached a temperature of almost 203°C, while the die was at 206°C. During the 5 s of curing, all parts reached steady state in less than 2 s

Published in:

IEEE Transactions on Components and Packaging Technologies  (Volume:24 ,  Issue: 4 )