Cart (Loading....) | Create Account
Close category search window

A novel approach for flip chip solder joint quality inspection: laser ultrasound and interferometric system

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Sheng Liu ; Georgia Inst. of Technol., Atlanta, GA, USA ; Erdahl, D. ; Ume, I.C. ; Achari, A.
more authors

A novel, noncontact, nondestructive approach for flip chip solder joint quality inspection is presented. In this technique, a pulsed laser generates ultrasound on the chip's surface, exciting the whole chip into a vibration motion. An interferometer was used to measure the vibration displacement of the chip's surface. Because changes in solder joint quality produce a different vibration response, a value, "error ratio," is used to measure the difference between a good chip and a chip with defects. An automatic signal-processing algorithm to calculate the error ratio was developed and implemented, as well as a frequency analysis algorithm. The inspection system was characterized, and results are presented for two cases of flip chips with missing solder balls. Results indicate that a laser ultrasonic/interferometeric system offers great promise for solder bump inspection in flip chip, BGA, chip scale, and micro BGA packages

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:24 ,  Issue: 4 )

Date of Publication:

Dec 2001

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.