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Dynamic thermal multiport modeling of IC packages

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2 Author(s)
Rencz, M. ; MicReD Microelectron. Res. & Dev. Ltd., Budapest, Hungary ; Szekely, V.

The dynamic thermal behavior of electronic subsystems is characterized by their dynamic compact models. These models have to be similar to the steady state models in describing the fact that the heat is usually leaving at different locations (ports), necessitating multiport description of the thermal behavior. In our paper we present a method suitable for direct generation of multiport dynamic compact thermal models from a series of thermal transient simulations or measurements. The generated RC electrical equivalent circuit model, exercised with a network simulator program provided the same transient functions as the measured ones for various boundary conditions, proving the accuracy of the method

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Components and Packaging Technologies, IEEE Transactions on  (Volume:24 ,  Issue: 4 )