The degradation of 100-nm effective channel length pMOS transistors with 14 Å equivalent oxide thickness Jet Vapor Deposition (JVD) Si3N4 gate dielectric under hot-carrier stress is studied. Interface-state generation is identified as the dominant degradation mechanism. Hot-carrier-induced gate leakage may become a new reliability concern. Hot-carrier reliability of 14 Å Si3N4 transistors is compared to reliability of 16 Å SiO2 transistors
Published in:
Device and Materials Reliability, IEEE Transactions on
(Volume:1
,
Issue:
3
)
Date of Publication: Sep 2001