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Hot-carrier reliability comparison for pMOSFETs with ultrathin silicon-nitride and silicon-oxide gate dielectrics

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5 Author(s)
Polishchuk, I. ; Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA ; Yee-Chia Yeo ; Qiang Lu ; Tsu-Jae King
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The degradation of 100-nm effective channel length pMOS transistors with 14 Å equivalent oxide thickness Jet Vapor Deposition (JVD) Si3N4 gate dielectric under hot-carrier stress is studied. Interface-state generation is identified as the dominant degradation mechanism. Hot-carrier-induced gate leakage may become a new reliability concern. Hot-carrier reliability of 14 Å Si3N4 transistors is compared to reliability of 16 Å SiO2 transistors

Published in:
Device and Materials Reliability, IEEE Transactions on  (Volume:1 ,  Issue: 3 )

Date of Publication: Sep 2001

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